典型应用 Typical Application 密封应用 Sealing application 特点描述 Description 对不同基材粘接力表现优异 Good bonding strength to different kinds of substrate 固化时间 Typical Cure time 30min 150℃ 耐温 Operati
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典型应用
Typical Application
密封应用
Sealing application
特点描述
Description
对不同基材粘接力表现优异
Good bonding strength to different kinds of substrate
